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DTSTAMP:20181221T160731Z
LOCATION:D173
DTSTART;TZID=America/Chicago:20181115T110000
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UID:submissions.supercomputing.org_SC18_sess270_exforum137@linklings.com
SUMMARY:Enabling High Performance Memory for the Broad HPC markets
DESCRIPTION:Exhibitor Forum\nArchitectures, Memory\n\nEnabling High Perfor
 mance Memory for the Broad HPC markets\n\nSchlapka\n\nHigh performance com
 pute demands advanced memory solutions. Designing for maximum performance 
 has traditionally carried the burden of substantial investment in cost and
  time to implement "in package memory on silicon substrates". Early in 201
 8 Micron has introduced new technology being adopted across markets for pe
 rformance solutions. Memory performance required for applications like net
 working routing and switching, autonomous driving, Crypto mining, Gaming C
 onsoles, Graphics cards, and HPC acceleration.  In this discussion, Micron
  will outline packaged memory solutions, with bandwidth required for HPC a
 pplications with the ecosystem enablement and adoption deployed in product
 ion. For the HPC community, this is provide an easy implementation of high
  performance solutions.
URL:https://sc18.supercomputing.org/presentation/?id=exforum137&sess=sess2
 70
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