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DTSTART;TZID=America/Chicago:20181114T153000
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UID:submissions.supercomputing.org_SC18_sess275@linklings.com
SUMMARY:Datacenter and Cooling Technologies
DESCRIPTION:Exhibitor Forum\n\n\nThe Case for Thermoplastic Quick Disconne
 cts in Liquid Cooling\n\nAnderson\n\nLiquid cooling system components must
  meet requirements for chemical compatibility, flow rates, temperature/pre
 ssure exposures. Ease of use and reliability over long periods of time are
  additional desirable attributes. To avoid potential damage to expensive e
 lectronic equipment due to leaks, secure ...\n\n---------------------\nSpe
 cifying Rack Level High Density Liquid Cooling Solutions\n\nWood\n\nThe hi
 gher the density of heat generating equipment, the higher the risk of any 
 failure resulting from inadequate rack, row and room level cooling.  Prese
 nting rack level cooling design considerations and methods for managing hi
 gh heat loads in HPC applications.  Passive or active rear door solution..
 .\n\n---------------------\nTaming Datacenter Thermodynamics with Lenovo N
 eptune Technology\n\nZiegler, Kamath\n\nLenovo has been delivering solutio
 ns based on liquid-cooling since 2012 and installed the first x86-based wa
 rm-water (50°C intake) cooled cluster at Leibniz-Rechenzentrum (LRZ) in Mu
 nich, Germany.  The latest generation of technology based on direct to nod
 e (DTN) liquid cooling, the Lenovo ThinkSyst...\n
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